Press release

VIA and Toppan form Joint Venture for Copper-based Metal Mesh Touch Sensors.

August 18, 2016, Altdorf, Germany — Integrated Micro-Electronics Inc. (PH: IMI) and the shareholders of VIA optronics GmbH (VIA) announced the signing of a definitive agreement under which IMI will acquire a 76 percent stake in VIA, a leading optical bonding and display solutions provider, for EUR 47.4 million.


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